What is Multi-Chip Module (MCM) ? Multi-Chip design technologies based on MCM-L and MCM-C




MCM is abbreviation of Multi-Chip Module which is defined as a single unit containing two or more chips and an interconnection substrate which function together as a system building block.

MCM it is important in modern electronic miniaturization and microelectronic systems. Multi-Chip Module differ depending on the complexity and development of their designers and needs of end the users.

Why do we need multi-chip module?

We need MCM for:

  1. More functionality in one single chip
  2. Increase integration level of system (smaller size)
  3. No packaging of individual chips
  4. Still expensive; but used for high-end applications (e.g. Military, aerospace, medical devices and LED arrays ), a complete PC in a MCM possible



There are various multichip design technologies evolved including on MCM-L and MCM-C.

1. MCM-Ceramic (MCM-C)

This is Multi-Chip Module design technology which involves substrates based ceramic technologies

  1. Comparison with MCM-L:
  2. High wiring density
  3. Better electrical  and thermal  conductivity than  MCM-L
  4. Assemblies with components on both sides.
  5. Flexible packaging
  6. High  dielectric  constant(not suitable for high frequencies)


2. MCM-Laminated (MCM-L)

This is the Multi-Chip Module  technology which  is based on laminated  PCB technologies and using  microvias  that have evolved  to accomplish  the denser integration  requirements  of today’s  demands.

  1.  Comparison with MCM-C:
  2. Low cost
  3. Ease  of repairing of reworking  of individual layers
  4. Poor  thermal conductivity of substrate


Applications of Multi-Chip Modules (MCM), LED arrays, In Computers, in communication devices and other electronics devices.

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